Microsystem module

ABSTRACT

The invention concerns a microsystem module, in particular for use in microoptical systems, the module consisting of a body on the surface of which at least one functional area and support areas for attachment to adjacent microsystem components are provided. According to the invention, in order to provide a microsystem module of this type which can be connected to adjacent microstructure system components with an extremely good fit and in an exactly reproducible manner and preventing damage to the adjacent components and the sensitive functional areas of the microsystem module, the support areas are disposed in the region of outwardly projecting surface regions of the body which are set back relative to the support areas in the direction towards the interior of the body. The functional areas are disposed with very narrow tolerances in a dimensionally accurate manner relative to the support areas.

The invention relates to a microsystem module in particular forapplication in microoptical systems, consisting of a body, on thesurface of which provision is made for at least one functional area andsupport areas for attachment to adjacent components of a microsystem.

Such microsystem modules are to be used primarily in micro-optics inorder to connect light sources and light conductors with each other, orto shape the light beam at the end of a light conductor or on the outletof a light source in a special way, for example to have it bundled,collimated, diffracted or diverged. Such microsystem modules, however,can be used also elsewhere in microstructure systems, where certainfunctional areas, for example scanning areas have to be fixed in anexact spatial relation to the adjacent components.

Such a problem in the field of microoptics is known, for example from WO92/06046 A1. A microoptical lens described there consists of an oblongglass fiber, which is shaped flattened on three longitudinal sides androunded in the form of a cylinder jacket on the fourth longitudinalside.

With said known microoptical lens, the area rounded in the form of acylinder jacket serves as an optically effective boundary area, whereasthe area disposed opposite the area rounded in the form of a cylinderjacket serves as a plane support area for connection to adjacentcomponents, which are here designed in the form of diode lasers whoseemitted light is to be collimated. The diode lasers are here glued tothe support area of the microoptical lens with a suitable adhesive oroptical cement. This poses the risk that the microoptical lens is notexactly positioned as required for its function relative to the diodelasers. Furthermore, the sensitive emitter area of the diode laser maybe damaged during gluing or cementing.

The correct positioning of a microoptical lens relative to the emitterof a diode laser becomes substantially more difficult if the side of themicrooptical lens facing the diode laser has a shape deviating from theplane as well. Such microoptical lenses, which are intended ascollimators for diode lasers, are known, for example from U.S. Pat. No.5,181,224. Said known collimators can be connected to a diode laser, forexample only with considerable measuring expenditure and, if need be,with the help of adapters or fitted pieces. Of course, it is just asdifficult to connect such microoptical lenses with an exact fit toadjacent microoptical components elsewhere. Finally, the risk with suchmicrooptical lenses is that the optically effective boundary areas,which protrude in a convex form and which are very sensitive, aredamaged during transport, handling and mounting of the microopticallens.

Therefore, the problem of the invention is to create a microsystemmodule of the type specified above which can be connected to adjacentcomponents of a microstructure system with an extremely exact fit and inan exactly reproducible manner, whereby damage to the adjacentcomponents and the sensitive functional areas of the microsystem moduleis avoided.

The object of the invention is a microsystem module in particular foruse in microoptical systems, consisting of a body on the surface ofwhich at least one functional area and support areas for attachment toadjacent components of a microsystem are provided, whereby saidmicrosystem module is characterized in that

the support areas are arranged within the zone of the outwardlyprojecting surface areas of the body;

the functional areas are arranged in zones of the surface of the bodywhich are set back relative to the support areas in the direction towardthe interior of the body; and

the functional areas are arranged with extremely narrow tolerances andwith dimensional stability relative to the support areas.

With the microsystem module as defined by the invention, the sensitivefunctional areas project nowhere outwardly beyond the outer contour ofthe module, but are set back behind the support areas and accordinglywell-protected against damage by touching. Furthermore, they do not comeinto contact with the adjacent components during mounting, so thatdamage to the adjacent components, for example damage to the sensitiveemitter of diode lasers is reliably prevented,. Owing to the fact thatthe support areas are arranged with extremely narrow tolerances anddimensional stability relative to the functional areas already in thecourse of their manufacture, mounting of the module with dimensionalstability is highly facilitated because for mounting, only the supportareas have to be arranged on the module with the correct relation to theboundary surfaces of the adjacent components. If such relation in termsof dimension is correct, the arrangement of the functional area relativeto the adjacent components is automatically correct as well, provided,of course, the countersupport areas of said components are arranged withdimensional stability as well.

According to a useful further development of the invention provision ismade in the support areas for positively locking elements for engagingcorresponding positively locking elements on the adjacent components.Such positively locking elements, for example in the form of deepeningsand projections and/or grooves and springs make it possible to fix themicrosystem module with exact adjustment in all directions withoutrequiring costly measurements for the adjustment.

Furthermore, provision is made according to the invention. that thefunctional areas and/or the support areas are smoothly polished.Dimensional deviations caused by roughness of the surfaces are avoidedby polishing said areas. The dimensional relations between such polishedareas could be exactly fixed except for a few nanometers.

Provision is made according to a particularly preferred embodiment ofthe invention that the body consists of optically transparent materialand that the functional areas are designed in the form of opticallyeffective boundary areas, The term “optics” is understood in thefollowing to include all systems operating with electromagnetic waves inthe range of the visible and invisible (ultraviolet, infrared) light, upto the-microwaves (millimeter waves). Optically transparent material isunderstood to include materials such as optical glass, quartz,germanium, ruby, optical plastics etc., which are suitable for lettingthrough and to influence electromagnetic waves of said type. The lightis refracted on the optically effective boundary areas, reflected bytotal reflection or by a reflecting coating, and diffracted bydiffraction lines or diffraction gratings. The functional areas presenton the microsystem module suitable for microoptical systems can bedesigned in different ways. For example, they can be designed in theform of concave or convex lens surfaces, whereby all lens shapes knownfrom the field of microoptics can be produced. Likewise, plane surfacesthat are inclined versus each other can be arranged in the functionalareas for forming prisms, which refract or reflect the light.Furthermore, diffraction lines or diffraction gratings can be arrangedin the functional area, which diffract the light passing through.Finally, the functional areas can be wholly or partly coated with areflecting coating.

It is possible also, if need be, to arrange in each functional area agreat number of functional elements in the form of lenses and/or prismsand/or diffraction lines and/or reflecting surfaces. So-called lensarrays can be produced in this way on one single microoptical module.

Special advantages are obtained if functional areas are arranged on thebody on sides opposing each other diametrally, with the functionalelements of said functional areas being optically correlated through thebody. It is possible in this way to install on such a microopticalmodule optical systems which shape and further transmit the lightpassing through in all sorts of different ways.

A microoptical module designed according to the instruction of theinvention can be designed, for example in the form of a refractivecollimator that is connectable to a diode laser. With such a collimator,the functional area facing the emitter of the diode laser forms a prismwhose apex extends parallel with the longitudinal expanse of the emitterof the diode laser, and which is rounded off within the near proximityof the emitter. Furthermore, the apex angle of the prism is greater thanthe angle of emission orthogonally relative to the longitudinal expanseof the emitter of the diode laser. Finally, the functional area disposedopposite the emitter of the diode laser is designed in the form of acylindrical surface whose cylinder axis extends orthogonally relative tothe apex of the prism. Such a refractive collimator is capable ofreceiving and collimating the band of light emitted by the emitter ofthe diode laser with very low losses. Said collimator has a particularlyhigh numerical aperture of, for example 0.68 when quartz glass is used,and can consequently almost completely collimate the light emitted bythe diode laser. Said refractive collimator, too, advantageously hassupport areas projecting beyond the functional areas. The special designand the association of the functional areas relative to one another,however, offers the stated advantages also without the support areas.Therefore, the scope of protection of the patent is to relate also tocollimators of the last-mentioned type, where the support areasspecified in patent claim 1 are missing.

Another microoptical module designed according to the instruction of theinvention may be designed, for example in the form of a reflectiveoptical coupler, which is insertable between a diode laser and a lightwave conductor following the latter. Two functional elements arearranged on each of the functional areas of the optical coupler, namelya first aspherical cylinder lens and displaced relative to the latter aplane mirror on the first functional area, and a second asphericalcylinder lens on the second functional area. The cylinder axes of thetwo cylinder lenses extend orthogonally relative to each other. Theiroptical axes, on the other hand, are arranged parallel with one another.The emitter of the diode laser is arranged in front of the firstaspherical cylinder lens. A light band emitted by the emitter fallsthrough the. first cylinder lens into the microsystem module, hits theoppositely arranged aspherical cylinder mirror, is deflected from thereonto the plane mirror, and then exits from the microsystem modulethrough the second aspherical cylinder lens. Such a reflective opticalcoupler has an extremely short structural length and is capable ofreceiving the band of light emitted by the emitter of the diode laserwith very low losses and of coupling it focused into a light waveconductor. Said reflective optical coupler advantageously has supportareas projecting beyond the functional areas. However, the specialdesign and mutual association of the functional areas offers the statedadvantages also without said support areas. Therefore, the scope ofprotection of the patent is to cover also reflective optical couplers ofthe last-mentioned type, where the support areas specified in patentclaim 1 are missing.

Another microsystem module designed according to the instruction of theinvention may be designed, for example in the form of an optical printedcircuit board, by which at least two optoelectronic semiconductormodules can be connected to each other. For said purpose, the functionalareas are designed in the form of lenses for coupling light rays in andout, on the one hand, and as mirrors for guiding the light rays withinthe optical conductor board, on the other. Such an optical conductorboard is capable of receiving a light beam emitted by an optoelectronicsemiconductor module (IOE chip) connected to the input side via a firstlens and to guide the course of the light beam within the opticalconductor board by means of the mirrors in such a way that the lightbeam exits from the optical conductor board via a second lens and hits asecond optoelectronic semiconductor module connected to the output side.The two optoelectronic semiconductor modules are opticallyinter-connected with each other in this way for the purpose of dataexchange. By using suitably designed wave-selective beam switches it ispossible to connect a plurality of opto-electronic semiconductor modulesbidirectionally with each other. By using a great number of lenses andmirrors in the optical conductor boards it is possible also to realizemore complicated three-dimensional optical connection structures. Saidoptical conductor board advantageously has support areas projectingbeyond the functional areas. However, the special design and mutualassociation of the functional areas offer the stated advantages alsowithout said support areas. The scope of protection of the patenttherefore is to cover also optical conductor boards of thelast-mentioned type, where the support areas specified in patent claim 1are missing.

A microoptical module designed according to the instruction of theinvention as well may be connected, for example in the form of awave-selective beam switch to a light source, a light receiver and alight wave conductor. For this purpose, the functional area facing thelight source and the light wave conductor has a functional element withwave-selective properties, which provide the functional element with areflective or a refractive behavior depending on the wavelength of theinciding light rays. A beam of light originating from the light sourceis reflected by the wave-selective functional element in such a way thatit hits the light wave conductor. A beam of light exiting from the lightwave conductor is refracted by the same wave-selective functionalelement in such a way that it hits the light receiver. Such awave-selective beam switch permits bidirectional optical datatransmission via a light wave conductor. A diode laser is normally usedas the light source, whose focused band of light is coupled into thelight wave conductor via the wave-selective functional element of thebeam switch and a spherical lens. The light rays exiting from the lightwave conductor are refracted on the wave-selective functional element,run through the beam switch, exit from the latter on the opposite side,and hit the light receiver, for example a photodiode. Saidwave-selective beam switch advantageously has support areas projectingbeyond the functional areas. The special design and mutual associationof the functional areas, however, offer the stated advantages alsowithout said support areas. Therefore, the scope of protection of thepatent is to cover also wave-selective beam switches of thelast-mentioned type, where the support areas specified in patent claim 1are missing.

Furthermore, the object of the invention is a process for producingmicrosystem modules of the type specified above, whereby said process ischaracterized in that the support areas and the deepenings with thesurface contours of the functional areas associated with said supportareas are produced on a substrate by ultrasound oscillation lapping witha correspondingly shaped single-part lapping mold. With the processproposed according to the invention, the microstructures to be producedon the substrate, namely the support areas and the deepenings with thesurface contours of the functional areas can be produced with highdimensional accuracy. In said process, a lapping mold made from hardmetal and mechanically oscillating at ultrasound frequency and having anegative imprint of the microstructure to be produced, is pressedagainst the substrate with the use of a sufficiently hard lapping agent(hard substance-powder or paste), thereby forming on the surface of thesubstrate a positive print of the lapping mold with high dimensionalaccuracy and relatively low surface roughness. Due to the fact that asingle-part lapping mold is used it is possible in a simple manner tomaintain the dimensional relation between the support areas and thefunctional areas with the highest possible accuracy.

The surface roughnesses are so low that they can be polished withoutproblems with an electron beam. The energy density of the electron beamis adjusted in this connection in such a way that only the surface ofthe area to be polished is slightly melted, so that the surface tensionproduces an absolutely smooth surface. Such polishing with an electronbeam is the object of a German patent application DE 42 34 740 A1 by thesame applicant.

For the mass production of microsystem modules of the type explainedabove, the invention proposes that the negative contours of a greatnumber of microsystem modules are formed on a lapping mold with a largesurface area; that the lapping mold is reproduced on a substrate havinga correspondingly large size; and that the substrate is subsequentlydivided in the individual microsystem modules.

An exemplified embodiment of the invention is explained in greaterdetail in the following with the help of the drawings, in which:

FIG. 1 shows a vertical longitudinal section through a microsystemmodule signed in the form of a refractive collimator, w a diode laserconnected thereto.

FIG. 2 shows a horizontal longitudinal section through the microsystemmodule according to FIG. 1.

FIG. 3 is a perspective representation of the microsystem moduleaccording to 1 and 2.

FIG. 4 is a perspective representation of a microsystem module withpositive locking elements in the support areas for engagingcorresponding positively locking elements on adjacent components.

FIG. 5 is a perspective representation of two cylinder lens arraysarranged one after the other.

FIG. 6 is a perspective representation of a microsystem module withoptically correlated functional areas opposing each other diametrally.

FIG. 6 is a side view of a microsystem module designed in the form of areflective optical coupler.

FIG. 8 is a top view of the microsystem module according to FIG. 7.

FIG. 9 is a longitudinal section through a microsystem module designedin the form of an optical conductor board.

FIG. 10 shows a longitudinal section through a microsystem moduledesigned in the form of a wave-selective beam switch.

FIG. 11 shows by a schematic sectional view the lapping process forproducing a crude molding of a microsystem module from a substrate.

FIG. 12 shows by a schematic sectional view the lapping process forproducing a crude molding of a plurality of functional elements from asubstrate, such elements being arranged next to each other on theoptically effective boundary areas; and

FIG. 13 shows by schematic sectional view the polishing of the opticallyeffective boundary areas by means of an electron beam.

Corresponding reference symbols are used in the following description ofthe drawings for identical components.

In FIG. 1, a microsystem module as defined by the invention for use inmicrooptical systems is denoted in its entirety by reference numeral 1.Microsystem module 1 is designed as a refractive collimator. It consistsof a body 2, for example made from quartz glass or another opticallytransparent material. Deepenings 3 and 4 are worked into body 2,. withfunctional areas 5 and 6 being arranged on their bottoms. Functionalarea 5 has the shape of a prism with an apex angle alpha=85°. Within theregion of its apex the prism is provided with a rounding 5 a. Functionalarea 6 has an approximately cylinder jacket-shaped curvature, wherebythe axis of said cylinder jacket-shaped curvature extends perpendicularto the longitudinal expanse of the apex of the prism on the opposite,optically effective boundary area 5.

Furthermore, body 2 is provided with support areas 7 and 8 serving forthe connection to adjacent optical components 9, for example for theconnection to a diode laser, which is provided with countersupport areas10 corresponding with support areas 7. Support areas 7 and 8 areprovided with positively locking elements 7 a and, respectively 8 a, forexample in the form of projections, the latter protruding from the areaand engaging corresponding positively locking counter elements 10 a inthe counter-support areas 10 on the adjacent optical components 9.

FIGS. 1 and 2 show that support areas 7 and 8 are disposed in an exactlydefined dimensional relation to functional areas 5 and 6. Owing to thefact that functional areas 5 and 6 are set back relative to supportareas 7 and 8 in the direction of the interior of body 2, they arearranged in a well-protected way. With the help of support areas 7 and 8on body 2 and countersupport areas 10 on the abutting optical component9, microsystem module 1 can be positioned in a simple way on diode laser11 with high accuracy, namely in a way such that the apex of the prismin functional area 5 is disposed exactly opposite the emitter of diodelaser 11 and at the same time aligned exactly parallel with thelongitudinal expanse of said laser.

The above-described microsystem module 1 is perspectively shown in FIG.3.

FIG. 4 shows a microsystem module 1 designed in the form of a refractivecollimator whose support areas 7, which border on an optical component9, are provided with projections 50. Said projections 50 engagecorresponding deepenings 51 on the adjacent component 9. This permitsfixing of microsystem module 1 on adjacent component 9 with exactadjustment in the Y- and z-directions without requiring costlymeasurements for such adjustment.

FIG. 5 shows two microsystem modules 1 each having a great number offunctional elements in the form of cylinder lenses arranged on theirfunctional areas. The two microsystem modules 1 each form a cylinderlens array 60 and 61. The cylinder axes of cylinder lens arrays 60 and61 extend parallel with each other. On their support areas 7, the twocylinder lens arrays 60 and 61 border on each other with functionalareas facing each other. The cylinder axes of the two cylinder lensarrays 60 and 61 extend at a right angle relative to each other. Suchcylinder lens arrays 60 and 61 are frequently arranged one after theother in order to obtain in this way optimal transformation and shapingof a bundle of light rays passing through such arrays.

FIG. 6 shows a microsystem module 1 having cylinder lens arrays 70 and71, respectively, arranged on its body 2 on diametrally opposed sides,said arrays being optically correlated through body 2. The cylinder axesof the two cylinder lens arrays 70 and 71 extend at a right anglerelative to each other.

FIG. 7 shows a microsystem module 1 designed in the form of a reflectiveoptical coupler. Functional areas 5 and 6 are arranged on its body 2 ondiametrally opposed sides and the functional elements 80 to 83 of saidfunctional areas are optically correlated through body 2. The emitter ofa diode laser (not shown) is arranged in front of an aspherical cylinderlens 80, said emitter emitting a band of light. Said band of lightenters into body 2 through a cylinder lens 80, hits an asphericalcylinder mirror 81, and is reflected from said mirror onto a planemirror 82 and from there onto a second aspherical cylinder lens 83. Theband of light then exits through cylinder lens 83 from body 2 and isfinally coupled into a light wave conductor (also not shown), the latterbeing arranged in front of cylinder lens 83. The cylinder axes of thetwo cylinder lenses 80 and 83 extend orthogonally and their optical axes84 and 85 extend parallel with each other. Such a reflective opticalcoupler serves for focusing the band of light emitted by the diode laserand for coupling such light into the light wave conductor. FIG. 8 is atop view of the reflective optical coupler shown in FIG. 7.

FIG. 9 shows a microsystem module 1 designed in the form of an opticalconductor board, which is connected to two optoelectronic semiconductormodules 90 and 91 and optically connected said modules with each other.The functional areas of the optical conductor board are designed in theform of lenses 93 and 96 for coupling light rays in and out, on the onehand, and in the form of mirrors 94 and 95 for guiding the beam withinthe optical conductor board, on the other. The optical interconnectionsare realized as follows: the first optoelectronic semiconductor module90 emits a light a beam 92, which is coupled into body 2 of the opticalconductor board via a first lens 93. Light beam 92 is guided via mirrors94 and 95 in such a way that it is coupled out of body 2 again via asecond lens 96 and hits the second optoelectronic semiconductor module91. Connecting the two optoelectronic semiconductor modules 90 and 91 inthe reserve direction is possible as well; i.e., semiconductor module 91emits a light beam 92, which is then received by semiconductor module90. By using suitable beam switches is it possible to realize abidirectional interconnection of the two optoelectronic semiconductormodules 90 and 91.

FIG. 10 shows a microsystem module 1 designed in the form of awave-selective beam switch. Said microsystem module is connected to alight source 102, a light receiver 107 and a light wave conductor 105.Functional area 6 facing light source 102 and light wave conductor 105has a functional element 101 with a wave-selective behavior. A diodelaser is used as light source 102. The emitter of diode laser 102 emitsa light band 103, which is reflected on the wave-selective functionalelement 101 and coupled into light wave conductor 105 via a sphericallens 104. Now, if a light beam 106 is coupled out of light waveconductor 105, said light beam is refracted on wave-selective functionalelement 101 and on an oppositely disposed functional element 100 in sucha way that it hits light receiver 107. The latter is designed in theform of a photodiode. Such a wave-selective beam switch permitsbidirectional optical data transmission via a light wave conductor 105.

The production process for manufacturing microsystem modules 1 asdefined by the invention is schematically shown in FIGS. 11 to 13. Thefirst step of the manufacturing process is based on a, for exampleashlar-shaped substrate 20 made from optically transparent material, forexample quartz glass. Deepenings 3 and 4 in the ashlar-shaped quartzglass body are produced by ultrasound vibration lapping. This involvesundirectional cutting with loose hard-substance grains finelydistributed in a liquid or paste, such grains being activated by alapping mold made from hard metal and vibrating at ultrasound frequency.

The ultrasound vibration lapping for producing a crude shape of anindividual microsystem module 1 is schematically shown in FIG. 11. Thelapping mold is denoted by reference numeral 21. On its surface facingthe substrate 20 it has a negative imprint of deepenings 3 and 4 andfunctional areas 5 and 6 to be produced. On the side facing substrate20, lapping mold 21 is coated with a coating 22 consisting of abrasive.Preferably, such abrasive is a grinding powder containing grains of ahard material in a finely distributed form.

For the lapping process, lapping mold 21 provided with abrasive coating22 is stimulated with mechanical vibrations in the ultrasound range andpressed against substrate 20, so that the material of substrate 20 isremoved by undirectional cutting. As soon as lapping mold 21 comes intocontact with area regions 7, 8 of substrate 20, the cutting process isstopped. As the result, an exactly positive copy of lapping mold 21 isformed on substrate 20. It is possible in this way to produce therequired structures on the surface of micro-system module 1 to beproduced with high dimensional accuracy.

FIG. 12 shows the manufacture of a plurality of functional elements bymeans of the ultra sound lapping vibration lapping process, the elementsbeing arranged next to each other on a substrate with a large surfacearea. On its surface facing a substrate 30 with a large surface area, alapping mold 31 with a large surface area is provided with a negativecopy of a plurality of deepenings and optically effective boundary areasdisposed next to one another. On the side facing substrate 30, thelapping mold is coated with a layer 32 consisting of abrasive. Asexplained for the manufacture of a single microsystem module, thematerial of substrate 30 is now removed by undirectional cutting withmechanical vibrations in the ultrasound range vertically directed at thesubstrate. So-called lens arrays can be produced in this way on onesingle microoptical module or the individual functional elements can bedivided after their manufacture along lines 33 in individual microsystemmodules 1.

Functional areas 5 and 6 are finally polished in a second process stepwith a high-energy electron beam 43. Said step is shown in FIG. 13. Theelectron gun shown there for generating a high-energy electron beam 43has a cathode 40 serving as electron source, an anode 41 serving foraccelerating electron beam 43, and a slotted shutter 42 for shapingelectron beam 43. The very high-energy electron beam 43 so produced,which has the shape of a flat rectangular band, is directed at thesurfaces on substrate 2 to be polished. Substrate 2 is then movedtransversely to the plane of the band-shaped electron beam 43. The feedof energy into the surface to be polished is controlled in thisconnection by suitable measures in such a way that only the surface isslightly melted over the depth of the roughnesses present, namely ineach case to such an extent that the roughness present is compensated bythe surface tensions of the melt.

What is claimed is:
 1. A microsystem module for a microoptical system,comprising an optically transparent body having (a) at least one firstsupport area and at least one second support area arranged in respectiveoutwardly projecting portions of said body, each of said support areashaving a positively locking element for engaging a corresponding lockingelement on an adjacent component of the microoptical system, eachpositively locking element of said at least one first support areaextending in a perpendicular longitudinal direction to each positivelylocking element of said at least one second support area to provide apositive locking function; and (b) at least one functional areacomprising a concave or convex lens formed in a surface of said bodyinterior of said first and second support areas and arranged with verynarrow tolerances and dimensional accuracy relative to the support areasto form an optically effective boundary area.
 2. The microsystem moduleaccording to claim 1 wherein said at least one functional area and/orthe support areas are smoothly polished.
 3. The microsystem moduleaccording to claim 1 wherein there are at least two functional areaswhich are arranged on the body on diametrically opposed sides, with thefunctional elements of said areas being optically correlated through thebody.
 4. The microsystem module according to claim 3, wherein saidmicrosystem module is designed in the form of a reflective opticalcoupler insertable between a diode laser and a light wave conductoradjoining said laser; two functional elements are arranged on each ofthe at least two functional areas, a first functional area of said atleast two functional areas comprising a first aspherical cylinder lensand a plane mirror displaced relative to said first aspherical cylinderlens, and a second functional area of said at least two functional areascomprising an aspherical cylinder mirror and a second asphericalcylinder lens displaced relative to said aspherical cylinder mirror; thecylinder axes of the two cylinder lenses extend orthogonally relative toeach other; and the optical axes of the two cylinder lenses are arrangedparallel with each other.
 5. The microsystem module according to claim3, wherein said microsystem module is designed in the form of an opticalconductor board, by which at least two optoelectronic semiconductormodules are connectable to each other; and the at least two functionalareas comprise lenses for coupling light rays in and out, and mirrorsfor guiding the beam within the optical conductor board.
 6. Themicrosystem module according to claim 3, wherein said microsystem moduleis designed in the form of a wave-sensitive beam switch connectable to alight source, a light receiver and a light wave conductor; and thefunctional area facing the light source and the light wave conductor hasa functional element with wave-sensitive properties.
 7. A process forproducing a microsystem module for a microoptical system comprising anoptically transparent body having (a) at least one first support areaand at least one second support area arranged in respective outwardlyprojecting portions of said body, each of said support areas having apositively locking element for engaging a corresponding locking elementon an adjacent component of the microoptical system, each positivelylocking element of said at least one first support area extending in aperpendicular longitudinal direction to each positively locking elementof said at least one second support area to provide a positive lockingfunction; and (b) at least one functional area comprising a concave orconvex lens formed in a surface of said body interior of said first andsecond support areas and arranged with very narrow tolerances anddimensional accuracy relative to the support areas to form an opticallyeffective boundary area; said process comprising the steps of: providinga substrate comprising an optically transparent material; providing asingle-part lapping mold having a contour corresponding to a contour tobe produced on said substrate; and producing by ultrasound vibrationlapping on said substrate said at least one functional area in thesurface of said substrate interior of said first and second supportareas using the lapping mold.
 8. The process according to claim 7,wherein the lapping mold comprises a negative contour of a plurality ofmicrosystem modules wherein the lapping mold has a large surface areamodeled on a substrate with a correspondingly large surface area; andwherein the process further comprises dividing the substrate intoindividual microsystem modules after producing said at least onefunctional area on said substrate.
 9. The process according to claim 7,further comprising the step of polishing the functional areas and thesupport areas with an electron beam after producing said at least onefunctional area on said substrate.